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Henan Jinlun Superhard Material Co., Ltd [Henan,China] Business Type:Manufacturer Main Markets: Americas , Asia , East Europe , Europe , Middle East , West Europe , Worldwide Exporter:1% - 10% Certs:ISO9001, CE Description:Diamond Grinding Wheel for Sapphire,Diamond Grinding Wheel for Wafer,Wafer Thinning Wheel

Henan Jinlun Superhard Material Co., Ltd

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Home > Products > Super Abrasives > Resin Bond Grinding Wheels > High Precision Wafer Grinding Wheels

High Precision Wafer Grinding Wheels
  • High Precision Wafer Grinding Wheels
  • High Precision Wafer Grinding Wheels
  • High Precision Wafer Grinding Wheels
  • High Precision Wafer Grinding Wheels

High Precision Wafer Grinding Wheels

$789 - 980 /Piece/Pieces
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Overview
Product Attributes

Model No.: HNKMRBGW013

Brand: Kemei ABRASIVES

Support Customization: Oem, Odm, Obm

Place Of Origin: China

Species: Abrasive Disc

Material: Diamond Abrasive: Mesh size:200 grit

Bond: Resin: Diameter:200mm

Working Layter: Three Rows: Feature: on grinder

Thickness : 45mm: Bore Size: 127mm

Supply Ability & Additional Information

Packaging: carton bubble wrap,wooden pallet

Productivity: 5000pcs per month

Transportation: Ocean,Land,Air,Express,Others

Place of Origin: Shangjie District, Zhengzhou City, Henan Province, China

Supply Ability: 1000 pieces per day

Certificate: 3A

HS Code: 8202911000

Port: Zhengzhou,Qingdao,Shanghai

Payment Type: T/T,Paypal,Money Gram,Western Union,Others

Incoterm: FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
carton bubble wrap,wooden pallet
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The IF Series in-feed Grinding Wheels are excellent for processing not only silicon, but also compound semiconductors, ceramics, crystals, and a wide range of other materials. In addition, kemei offers applications and IF Series wheels to match virtually any wafer size or processing requirement. Capable of precision grinding to planarize etched wafers.

Kemei produces all kinds of Diamond Grinding Wheels, such as metal bond and Resin Bond Grinding Wheels which are used for all kinds of applications. Contact us for more information.

Product Parameters:

Material  :    diamond abrasive

Bond :          resin bond

Brand:          KEMEI

Feature:       high precision grinding wheels

Compatible Material :silicon wafer, silicon-based chips, crystal, 

DISCO-silicon-wafer-grinding-wheels







 



Product Categories : Super Abrasives > Resin Bond Grinding Wheels

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