Silicon Backside Grinding Wheel

This resin bond diamond grinding wheel is used for back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips. The back Grinding Wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

Kemei produces all types if Diamond Grinding Wheels, such as diamond grinding wheels, Cbn Grinding Wheels, Resin Bond Grinding Wheels, Metal Bond Diamond Wheels. We can produce any size and any grits, to fully meet with your grinding applications. Contact us for more.

Product Parameters:

Material  :    diamond abrasive

Bond :          resin bond

Brand:          KEMEI

Feature:       surface polishing, surface thinning; 

Compatible Material :silicon wafer, silicon-based chips;