Wafter Backside Thinning Wheel

Silicon Backside Grinding Wheel

• Brand: Kemei ABRASIVES
• Packaging: carton bubble wrap,wooden pall...
• Supply Ability: 1000 pieces per day
• Min. Order: 1 Piece/Pieces

This resin bond diamond grinding wheel is used for back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips. The back grinding wheels can be used for the Japanese ,German,...

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High Precision Wafer Grinding Wheels

• Brand: Kemei ABRASIVES
• Packaging: carton bubble wrap,wooden pall...
• Supply Ability: 1000 pieces per day
• Min. Order: 1 Piece/Pieces

The IF Series in-feed grinding wheels are excellent for processing not only silicon, but also compound semiconductors, ceramics, crystals, and a wide range of other materials. In addition, kemei offers applications and IF Series wheels to match virtually any wafer size or processing requirement. Capable of precision...

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