1a8 Diamond Cutting Blade For Semiconductor

1A1R Resin Bond CBN Cutting Wheel 0.03mm Thickness

• Brand: Kemei ABRASIVES
• Packaging: carton bubble wrap,wooden pall...
• Supply Ability: 1000 pieces per day
• Min. Order: 10 Piece/Pieces

This diamond/CBN slicing blade has ultra thin diamond/CBN working layer as thin as 0.03mm thickness. It is used for cutting and slotting the front and back surfaces of multiple-blade carbide tools, cutters, drills and other tools. The cutting blade is for processing of flat machine part surfaces, semiconductor,...

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Resin Diamond Single Concave Grinding Wheel

• Brand: Kemei Abrasive
• Packaging: carton packing
• Supply Ability: 1000 pieces/ per day
• Certificate: AAA

Resin diamond grinding wheel, good self-sharpening, sharp cutting, high grinding efficiency, less heating, not easy to burn the workpiece, suitable for most tools rough grinding, fine grinding, semi-fine grinding, polishing. Main processing hard alloy, optical glass, magnetic materials, semiconductor materials, etc....

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Resin Diamond Slotting Wheel

• Brand: Kemei Abrasive
• Packaging: carton packing
• Supply Ability: 500 pieces per day
• Certificate: AAA

Resin binder superhard material tools are mainly made of diamond or cBN as abrasive, tree powder as adhesive, adding appropriate filling materials, and through formulation design, weighing and mixing, hot pressing, secondary curing, subsequent processing and other processes, which are suitable for different grinding...

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Resin Diamond Cutting Pieces for Glass

• Brand: Kemei Abrasive
• Packaging: carton packing
• Supply Ability: 1000 pieces /per day
• Certificate: AAA

Resin diamond resin binder, with good self-sharpening, sharp cutting, high grinding efficiency, processing workpiece surface roughness is low, less heating, not easy to burn workpiece and other characteristics, suitable for most of the workpiece material rough grinding, semi-fine grinding, grinding, polishing, etc.....

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